A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connections
Dong An(North University of China), Shuaishuai Cheng(North University of China), Zhiyi Zhang(North University of China), Can Jiang(Wuhan Institute of Technology), Haoming Fang(Peking University), Jiaxiong Li(Georgia Institute of Technology), Yaqing Liu(North University of China), Ching‐Ping Wong(Georgia Institute of Technology)
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