Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment
Guoyun Zhou(University of Electronic Science and Technology of China), Gen Liu(ITER), Wei He(Chinese Academy of Sciences), Shuai Wang(University of Electronic Science and Technology of China), Xiaofeng Jin(Guangdong Testing Institute for Product Quality Supervision), Shouxu Wang(Golden Concord Group (China)), Shijin Chen(Harbin Institute of Technology), Longjiang Deng(University of Electronic Science and Technology of China), Xueping Gou(University of Electronic Science and Technology of China)
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