Formation of hot, stable, long-lived field-reversed configuration plasmas on the C-2W device
H. Gota(TAE Technologies, Inc (United States)), S. Krause(TAE Technologies, Inc (United States)), Sean Dettrick(TAE Technologies, Inc (United States)), E. Barraza(TAE Technologies, Inc (United States)), K. Zhai(TAE Technologies, Inc (United States)), Daniel Fulton(Los Alamos National Laboratory), Vladimir G. Sokolov(TAE Technologies, Inc (United States)), А. А. Корепанов(TAE Technologies, Inc (United States)), Ivan Isakov(TAE Technologies, Inc (United States)), Ami DuBois(TAE Technologies, Inc (United States)), U. Guerrero(TAE Technologies, Inc (United States)), Michl Binderbauer(TAE Technologies, Inc (United States)), P. Feng(TAE Technologies, Inc (United States)), Laura Galeotti(University of Urbino), A. D. Van Drie(TAE Technologies, Inc (United States)), F. Ceccherini(TAE Technologies, Inc (United States)), John Kinley(TAE Technologies, Inc (United States)), Xiaokang Yang(TAE Technologies, Inc (United States)), K. Hubbard(Arizona State University), D. Gupta(TAE Technologies, Inc (United States)), L. C. Steinhauer(TAE Technologies, Inc (United States)), D. Fallah(TAE Technologies, Inc (United States)), R. Andow(TAE Technologies, Inc (United States)), B. H. Deng(University of California, Los Angeles), A. Dunaevsky(TAE Technologies, Inc (United States)), C. Finucane(TAE Technologies, Inc (United States)), S. Gupta(TAE Technologies, Inc (United States)), K. Galvin(TAE Technologies, Inc (United States)), E. Bomgardner(TAE Technologies, Inc (United States)), E. Trask(Los Alamos National Laboratory), M. Tuszewski(Los Alamos National Laboratory), A. Chirumamilla(TAE Technologies, Inc (United States)), E. Granstedt(TAE Technologies, Inc (United States)), T. DeHaas(TAE Technologies, Inc (United States)), S. Korepanov(TAE Technologies, Inc (United States)), M. Beall(TAE Technologies, Inc (United States)), J. Roméro(TAE Technologies, Inc (United States)), Richard Magee, I. Allfrey, J. D. Douglass(Sandia National Laboratories), S. Putvinski(TAE Technologies, Inc (United States)), T. Roche(TAE Technologies, Inc (United States)), P. N. Yushmanov(Kurchatov Institute), Y. Song(TAE Technologies, Inc (United States)), R. Clary(TAE Technologies, Inc (United States)), M. C. Thompson(TAE Technologies, Inc (United States)), T. Tajima(Shibaura Institute of Technology), N. Bolte(TAE Technologies, Inc (United States)), A. Smirnov(TAE Technologies, Inc (United States)), Martin Griswold(TAE Technologies, Inc (United States))
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