The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
C. C. Liao(Chongqing University), Yue Xu(Chongqing University), Denglin Fu(Chongqing University), Shengtao Zhang(Chongqing University), Yujie Qiang(University of Science and Technology Beijing), Gen Liu(Huaibei Normal University), Bochuan Tan(Chongqing University), Mingxing Tang(Chongqing University), Shijin Chen
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