The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
C. C. Liao(Chongqing University), Yue Xu(Chongqing University), Denglin Fu(Chongqing University), Shengtao Zhang(Shandong Jiaotong University), Yujie Qiang(University of Science and Technology Beijing), Gen Liu(ITER), Bochuan Tan(Chongqing University), Mingxing Tang(Chongqing University), Shijin Chen(Harbin Institute of Technology)
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