Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Cheng-Ta Ko, Iris Xu, Rozalia Beica(Dow Chemical (United States)), Koh Sau Wee(Huawei Technologies (China)), N.C. Lee(Indium Corporation (United States)), Chieh-Lin Chang(Dow Chemical (United States)), Kai Wu(King University), Jhih-Yuan Pan(Dow Chemical (United States)), Eric Ng(ASM Pacific Technology (China)), Xi Cao(Huawei Technologies (China)), Curry Lin, Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), Mian Tao(Hong Kong University of Science and Technology), S. W. Ricky Lee(University of Hong Kong), Hsing-Hui Wu(Dow Chemical (United States)), Y.H. Chen(Dow Chemical (United States)), Margie Li(ASM Pacific Technology (China)), Zhang Li(Shanghai University of Medicine and Health Sciences), Nelson Fan(ASM Pacific Technology (China)), Ming Li(ASM Pacific Technology (China)), Tony Chen(Hospital for Special Surgery), Henry Yang(Micron Corporation (United States)), J.-W. Lin(Micron Corporation (United States)), Marc Lin(Dow Chemical (United States)), Yiu-Ming Cheung(ASM Pacific Technology (China)), K. H. Tan, Zhong Cheng(Huawei Technologies (China)), John H. Lau(ASM Pacific Technology (China)), Ji Hao(ASM Pacific Technology (China)), Jeffery C. C. Lo(Hong Kong University of Science and Technology)
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