Fabrication and Characterization of Annular Copper Through-Silicon via for Passive Interposer Applications

Yong Guan(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Jing Chen(Shanghai Jiao Tong University), Shenglin Ma(Xiamen University), Qinghua Zeng(Peking University)
IEEE Transactions on Semiconductor Manufacturing
February 12, 2018
Cited by 7


Related Papers