Effect of Metallic Materials Films on the Properties of Copper/Tin Micro-Bump Thermo-Compression Bonding
Yong Guan(Peking University), Yufeng Jin(Peking University), Wei Meng(Integrated Chinese Medicine (China)), Jing Chen(Shanghai Jiao Tong University), Shenglin Ma(Xiamen University), Qinghua Zeng(Peking University)
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