Fine‐pitch through‐silicon via integration with self‐aligned back‐side benzocyclobutene passivation layer

Yong Guan(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Jing Chen(Shanghai Jiao Tong University), Shenglin Ma(Xiamen University), Qinghua Zeng(Peking University)
Micro & Nano Letters
August 19, 2016
Cited by 2


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