A new soft breakdown model for thin thermal SiO/sub 2/ films under constant current stress

Takashi Tomita(Murata (Japan)), Kenji Taniguchi, T. Sakura(The University of Osaka), Hiroto Utsunomiya(Hiroshima University), Yoshinari Kamakura(The University of Osaka)
IEEE Transactions on Electron Devices
January 1, 1999
Cited by 64


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