A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures
Lijun Jiang(Hebei Medical University), Kaustav Banerjee(University of California, Santa Barbara), A. Deutsch(IBM (United States)), Alain Caron(IBM Research - Thomas J. Watson Research Center), Howard J. Smith(IBM Research - Thomas J. Watson Research Center), Barry J. Rubin(IBM (United States)), Alan J. Weger(IBM Research - Thomas J. Watson Research Center), Chuan Xu(Trinity College)
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