3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology

Manos M. Tentzeris(Georgia Institute of Technology), J. Laskar(Georgia Institute of Technology), John Papapolymerou(Georgia Institute of Technology), S. Pinel(Georgia Institute of Technology), V. Palazzari(Georgia Institute of Technology), Renfu Li(Georgia Institute of Technology), G. DeJean(Georgia Institute of Technology), N. Papageorgiou(Georgia Institute of Technology), D Thompson(Georgia Institute of Technology), R. Bairavasubramanian(Georgia Institute of Technology), S. Sarkar(Georgia Institute of Technology), J.-H. Lee(Georgia Institute of Technology)
IEEE Transactions on Advanced Packaging
May 1, 2004
10.1109/tadvp.2004.828814
Cited by 108Open Access
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Abstract

Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and /spl mu/BGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2/spl times/1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75/spl times/35/spl times/0.2 mm/sup 3/) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-integrated RF and mm wave functions and modules.

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