Maskless Plasmonic Lithography at 22 nm Resolution

Liang Pan(University of California, Berkeley), Yong-Shik Park(University of California, Berkeley), Yi Xiong(University of California, Berkeley), Erick Ulin-Avila(University of California, Berkeley), Yuan Wang(University of California, Berkeley), Li Zeng(University of California, Berkeley), Shaomin Xiong(University of California, Berkeley), Junsuk Rho(University of California, Berkeley), Cheng Sun(Northwestern University), David B. Bogy(University of California, Berkeley), Xiang Zhang(University of California, Berkeley)
Scientific Reports
November 29, 2011
Cited by 193Open Access
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Abstract

Optical imaging and photolithography promise broad applications in nano-electronics, metrologies, and single-molecule biology. Light diffraction however sets a fundamental limit on optical resolution, and it poses a critical challenge to the down-scaling of nano-scale manufacturing. Surface plasmons have been used to circumvent the diffraction limit as they have shorter wavelengths. However, this approach has a trade-off between resolution and energy efficiency that arises from the substantial momentum mismatch. Here we report a novel multi-stage scheme that is capable of efficiently compressing the optical energy at deep sub-wavelength scales through the progressive coupling of propagating surface plasmons (PSPs) and localized surface plasmons (LSPs). Combining this with airbearing surface technology, we demonstrate a plasmonic lithography with 22 nm half-pitch resolution at scanning speeds up to 10 m/s. This low-cost scheme has the potential of higher throughput than current photolithography, and it opens a new approach towards the next generation semiconductor manufacturing.


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