Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
Chuan Xu(Trinity College), Kaustav Banerjee(University of California, Santa Barbara), Seshadri Kolluri(University of California, Santa Barbara), Howard Smith(IBM (United States)), A. Deutsch(IBM (United States)), Barry J. Rubin(IBM (United States)), Lijun Jiang(Hebei Medical University)
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