Formation of Ti2AlN phase after post-heat treatment of Ti–Al–N films deposited by pulsed magnetron sputtering
Ying Yang(Beijing Institute of Genomics), Chao Sun(Chinese Academy of Sciences), Jun Gong(Chinese Academy of Sciences), K. Bewilogua(Fraunhofer Institute for Surface Engineering and Thin Films), M. Keunecke(Fraunhofer Institute for Surface Engineering and Thin Films), Xin Jiang(State Key Laboratory of Electrical Insulation and Power Equipment), Christian Stein(Fraunhofer Institute for Surface Engineering and Thin Films), Lijun Gao(Shanghai University of Engineering Science)
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