The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure
Yong Xiang(University of Electronic Science and Technology of China), Andrew J. McKerrow(Texas Instruments (United States)), Joost J. Vlassak(Harvard University), M.T. Pérez‐Prado(IMDEA Materials), Ting Y. Tsui(Advanced Micro Devices (United States))
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