Failure analysis of integrated devices by scanning thermal microscopy (SThM)
G.B.M. Fiege(University of Wuppertal), L.J. Balk(Institut für Arbeitsmedizin, Sicherheitstechnik und Ergonomie), Volker K. S. Feige(Institut für Arbeitsmedizin, Sicherheitstechnik und Ergonomie), M. Maywald(Siemens (Germany)), J.C.H. Phang(National University of Singapore), S. Görlich(Siemens (Germany))
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