Failure analysis of integrated devices by scanning thermal microscopy (SThM)
G.B.M. Fiege(University of Wuppertal), L.J. Balk(Leibniz University Hannover), Volker K. S. Feige(Institut für Arbeitsmedizin, Sicherheitstechnik und Ergonomie), M. Maywald(Siemens (Germany)), J.C.H. Phang(National University of Singapore), S. Görlich(Siemens (Germany))
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