Vibration and drop analysis of 3D SiP with Through Silicon Via
Yang He(University of Science and Technology Beijing), Yufeng Jin(Peking University), Guanjiang Wang(Peking University), Zhiyuan Zhu(Henan Academy of Sciences), Guangyi Shi(Peking University), Yunhui Zhu(Peking University), Jing Chen(Shanghai Jiao Tong University), Min Miao(Information Technology Institute)
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