Effect of Additives on Shape Evolution during Electrodeposition

Yan Qin(Shanghai Electric (China)), Richard C. Alkire(University of Illinois Urbana-Champaign), Philippe M. Vereecken(University of Illinois Urbana-Champaign), Richard D. Braatz(Massachusetts Institute of Technology), Xiaohai Li(University of Illinois Urbana-Champaign), Xue Feng(Tsinghua University), P. C. Andricacos(IBM Research - Thomas J. Watson Research Center), Hariklia Deligianni(IBM Research - Thomas J. Watson Research Center)
Journal of The Electrochemical Society
January 1, 2008
Cited by 24


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