Investigation on W/Fe diffusion bonding using Ti foil and Ti powder interlayer by SPS
Hongyu Chen(Zhejiang University of Technology), Yucheng Wu(University of Alberta), Xiang Zan(Hefei University of Technology), Jun Zhang(Hefei University of Technology), Xiao–Yong Zhu(Hefei University of Technology), Guang–Nan Luo(Chinese Academy of Sciences), Laima Luo(Hefei University of Technology)
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