Highly scalable non-volatile resistive memory using simple binary oxide driven by asymmetric unipolar voltage pulses

In-Hwan Baek(Samsung (South Korea)), M.S. Lee(Samsung (South Korea)), S. Sco(Samsung (South Korea)), Myoung‐Jae Lee(Samsung (South Korea)), David H. Seo(Samsung (South Korea)), Dongseok Suh(Samsung (South Korea)), J.C. Park(Samsung (South Korea)), S.O. Park(Samsung (South Korea)), H.S. Kim(Samsung (South Korea)), In Kyeong Yoo(Samsung (South Korea)), U‐In Chung(Samsung (South Korea)), Jiwon Moon(Samsung (South Korea))
Unknown
April 19, 2005
Cited by 520

Abstract

Simple binary-TMO (transition metal oxide) resistive random access memory named as OxRRAM has been fully integrated with 0.18/spl mu/m CMOS technology, and its device as well as cell properties are reported for the first time. We confirmed that OxRRAM is highly compatible with the conventional CMOS process such that no other dedicated facility or process is necessary. Filamentary current paths, which are switched on or off by asymmetric unipolar voltage pulses, made the cell properties insensitive to cell or contact size promising high scalability. Also, OxRRAM showed excellent high temperature performance, even working at 300/spl deg/C without any significant degradation. With optimized TMO material and electrodes, OxRRAM operated successfully under 3V bias voltage and 2mA switching current at a TMO cell size smaller than 0.2/spl mu/m/sup 2/.


Related Papers

No related papers found

Powered by citation graph analysis