Effects of microstructure and vibration parameters on mechanical properties of nanoimprinted FeNiCrCoCu high-entropy alloysVan-Trung Pham, Quang-Bang Tao, Minh-Sang Tran et al.|Physica B Condensed Matter|2023Cited by 15
Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum methodHoang-Giang Nguyen, Te‐Hua Fang|Physica Scripta|2024Cited by 5