Thermal control of IC chips using phase change material: A CFD investigationAnant Sidhappa Kurhade, G. Murali|International Journal of Modern Physics C|2022Cited by 44
Predictive Placement of IC Chips using ANN-GA Approach for Efficient Thermal CoolingAnant Sidhappa Kurhade, G. Murali, Ramdas Biradar et al.|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024Cited by 44
A Comprehensive Evaluation of Recent Studies Investigating Nanofluids Utilization in Heat ExchangersShital Yashwant Waware, Sandeep Kore, Anant Sidhappa Kurhade et al.|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024Cited by 43
Performance Analysis of Corrugated Twisted Tape Inserts for Heat Transfer AugmentationAnant Sidhappa Kurhade, Prashant J Patil, Tushar Gadekar et al.|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024Cited by 28
Investigating the Effect of Heat Transfer Influenced by the Application of Wavy Corrugated Twisted Tape Inserts in Double Pipe Heat ExchangersAnant Sidhappa Kurhade, Shital Yashwant Waware, Prashant J Patil et al.|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024Cited by 26