D

Dae‐Hyeong Kim

Seoul National University

ORCID: 0000-0002-4722-1893

Publishes on Advanced Sensor and Energy Harvesting Materials, Conducting polymers and applications, Neuroscience and Neural Engineering. 298 papers and 51.8k citations.

298Publications
51.8kTotal Citations

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Top publicationsby citations

Epidermal Electronics
Dae‐Hyeong Kim, Nanshu Lu, Rui Ma et al.|Science|2011
Cited by 4.6kOpen Access

We report classes of electronic systems that achieve thicknesses, effective elastic moduli, bending stiffnesses, and areal mass densities matched to the epidermis. Unlike traditional wafer-based technologies, laminating such devices onto the skin leads to conformal contact and adequate adhesion based on van der Waals interactions alone, in a manner that is mechanically invisible to the user. We describe systems incorporating electrophysiological, temperature, and strain sensors, as well as transistors, light-emitting diodes, photodetectors, radio frequency inductors, capacitors, oscillators, and rectifying diodes. Solar cells and wireless coils provide options for power supply. We used this type of technology to measure electrical activity produced by the heart, brain, and skeletal muscles and show that the resulting data contain sufficient information for an unusual type of computer game controller.

Stretchable and Foldable Silicon Integrated Circuits
Cited by 1.7k

We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three-dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical devices, that require extreme mechanical deformations during installation/use and electronic properties approaching those of conventional systems built on brittle semiconductor wafers.