Thin loop heat pipe with twisted wires as wick structure for microelectronics
Kelvin Guessi Domiciano(Universidade Federal de Santa Catarina), Marcia Mantelli(Universidade Federal de Santa Catarina), Maria Cristina Amaral(Universidade Federal de Santa Catarina), Bianca Müller Martins(Universidade Federal de Santa Catarina), Lucas de Andrade Caldas(Universidade Federal de Santa Catarina), Larissa Krambeck(Universidade Federal de Santa Catarina), Anderson Camargo Moreira(Universidade Federal de Santa Catarina)
Cited by 0
Related Papers
Thin diffusion bonded flat loop heat pipes for electronics: Fabrication, modelling and testing
|Energy Conversion and Management|2022|36
Novel flat plate pulsating heat pipe with ultra sharp grooves
|Applied Thermal Engineering|2022|36
2,1,3-Benzothiadiazole-based fluorophores. Synthesis, electrochemical, thermal and photophysical characterization
|Dyes and Pigments|2016|30
A new flat electronics cooling device composed of internal parallel loop heat pipes
|Experimental and Computational Multiphase Flow|2024|18
Study of a new thin flat loop heat pipe for electronics
|Heat and Mass Transfer|2023|15