A dual-bioinspired laminated approach enables high thermal conductivity and superior toughness in zero-thermal-expansion copper composites

Buke Dong(Chinese Academy of Sciences), Tong Peng(Peking University), Wenhai Song(Chinese Academy of Sciences), Yuping Sun(Shandong University), Jianchao Lin(University of Science and Technology of China), Zhijian Tan(Chinese Academy of Sciences), Jie Chen(Chinese Academy of Sciences), Keke Liu(Chinese Academy of Sciences), Xuekai Zhang(Dongzhimen Hospital Affiliated to Beijing University of Chinese Medicine), Saichao Cao(Chinese Academy of Sciences), Jiawei Zeng(Chinese Academy of Sciences)
Acta Materialia
December 4, 2025
Cited by 1


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