Warpage prediction and optimization in ultra-thin fan-out panel-level packaging substrates via equivalent CTE correction and multi-layer shell element modeling

Liping Yang(Xinjiang Normal University), Yan Wang(Wuhan University of Technology), Li Zhang(Wuhan University of Technology), Ruoxi Zhang(Hubei University of Technology), Jiaren Huo(Shenzhen Metro (China))
Journal of Materials Science Materials in Electronics
November 1, 2025
Cited by 1


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