Prediction of Electromigration Failure of Solder Joints via Surrogate Model Integrated With Conformal Inference
Zheng Liu(University of Illinois Urbana-Champaign), Yumeng Li(Changchun University of Science and Technology), Hao Wu(Xihua University), Pingfeng Wang(University of Illinois Urbana-Champaign), Parth Bansal(University of Illinois Urbana-Champaign)
Cited by 0
Related Papers
In-situ reconstructed Cu/Cu2O heterogeneous nanorods with oxygen vacancies for enhanced electrocatalytic nitrate reduction to ammonia
|Chemical Engineering Journal|2023|108
Novel 3D printed TPMS scaffolds: microstructure, characteristics and applications in bone regeneration
|Journal of Tissue Engineering|2024|60
A smart coating with integrated physical antimicrobial and strain-mapping functionalities for orthopedic implants
|Science Advances|2023|50
Optimal sensor placement for permanent magnet synchronous motor condition monitoring using a digital twin-assisted fault diagnosis approach
|Reliability Engineering & System Safety|2023|49
A facile method for preparation of doped-N carbon material based on sisal and application for lead-carbon battery
|Journal of Cleaner Production|2018|46