Radiation Source Reconstruction for TSV-Based Chips and Multilayer Circuits via Optimized Neural Networks

Hao Cheng(Beijing University of Posts and Telecommunications), Yuanan Liu(Beijing University of Posts and Telecommunications), Yongle Wu(Beijing University of Posts and Telecommunications), Keyan Li(Beijing University of Posts and Telecommunications), Weimin Wang(Beijing University of Posts and Telecommunications)
IEEE Transactions on Electromagnetic Compatibility
September 24, 2025
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