Finite Element Optimization of Thermal-Mechanical Coupling in Smart P<sup>2</sup> Packagingaging Frontal Interconnects
Xiaowei Zhang(Chiba University), Huaiyu Ye(Xuzhou Medical College), Guoshuai Li(Chinese Academy of Sciences), Shenglin Zhang(Shenzhen Metro (China)), Xu Liu(Kunming University of Science and Technology), Peng Wang(Foxconn (China)), Yuqi Wang(Harbin Institute of Technology), Shaogang Wang(Delft University of Technology), Ling‐en Wang(Chinese Academy of Sciences), Renhui Liu(University of Science and Technology of China), Chenshan Gao(Southern University of Science and Technology)
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