Preparing Fab-skilled Engineers for the U.S. Chip Industry Through Hands-on Integrated Circuit Fabrication
Sandip Das(Kennesaw State University), A. Bruno Frazier(Georgia Institute of Technology), Seung R. Paik(Inha University), Benjamin Klein(Kennesaw State University)
Cited by 0
Related Papers
A Dynamic Convolutional Layer for short rangeweather prediction
|Unknown|2015|178
Comparison of optical VCSEL models on the simulation of oxide-confined devices
|IEEE Journal of Quantum Electronics|2001|94
Temperature Dependence of the Piezotronic Effect in ZnO Nanowires
|Nano Letters|2013|86
WHY HOLD‐UPS OCCUR: THE SELF‐ENFORCING RANGE OF CONTRACTUAL RELATIONSHIPS
|Economic Inquiry|1996|81
Theoretical Study of Piezo‐phototronic Nano‐LEDs
|Advanced Materials|2014|74