Medium-temperature promising candidate thermal management materials: Interfacial passivation via TTA ligands enhances thermal cyclability of copper foam/Bi-In phase change materials

Siyang Wang(South China University of Technology), Zhengguo Zhang(Ministry of Education), Yong Yu(South China University of Technology), Peng Xie(Guangzhou Automobile Group (China)), Jianfeng Hu(University of Science and Technology Liaoning)
Chemical Engineering Journal
August 21, 2025
Cited by 2


Related Papers