Medium-temperature promising candidate thermal management materials: Interfacial passivation via TTA ligands enhances thermal cyclability of copper foam/Bi-In phase change materials
Siyang Wang(South China University of Technology), Zhengguo Zhang(Ministry of Education), Yong Yu(South China University of Technology), Peng Xie(Guangzhou Automobile Group (China)), Jianfeng Hu(University of Science and Technology Liaoning)
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