A GaN Power Module Using a Copper PCB with Integrated Liquid-Cooled Heat Exchanger
Jingyuan Liang(University of Toronto), Wai Tung Ng(University of Toronto), Andrei Catuneanu(Advanced Technology and Research Corporation (United States)), Chi Ho Yeung(University of Toronto), Xiaoyun Zhang(Southeast University), Xuan Wang(North China University of Water Resources and Electric Power), Matthew Birkett(Advanced Technology and Research Corporation (United States))
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