Enhanced Thermal–Electrical Interconnect for Single-Sided Cooling SiC MOSFET Power Device Based on Polycrystalline Diamond

Yongmei Gan(State Key Laboratory of Electrical Insulation and Power Equipment), Fengtao Yang(State Key Laboratory of Electrical Insulation and Power Equipment), Yunqing Pei(State Key Laboratory of Electrical Insulation and Power Equipment), Laili Wang(University of Cambridge), Yan Wang(China Mobile (China))
IEEE Transactions on Power Electronics
July 18, 2025
Cited by 4


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