Enhanced Thermal–Electrical Interconnect for Single-Sided Cooling SiC MOSFET Power Device Based on Polycrystalline Diamond
Yongmei Gan(State Key Laboratory of Electrical Insulation and Power Equipment), Fengtao Yang(State Key Laboratory of Electrical Insulation and Power Equipment), Yunqing Pei(State Key Laboratory of Electrical Insulation and Power Equipment), Laili Wang(University of Cambridge), Yan Wang(China Mobile (China))
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