Multi-Scale Thermal Modeling of 3D-Heterogeneous Integrated Processing-Near-Memory Chip for Edge Large Language Model Inference

Awang Ma(Tsinghua University), Huaqiang Wu(Tsinghua University), Yiming Zhou(Tsinghua University), Xing Mou(Tsinghua University), Peng Yao(Tsinghua University), Yudeng Lin(Tsinghua University), Zhiming Kuang(Harvard University), He Qian(Tsinghua University), Jianshi Tang(Tsinghua University), Yuyao Lu(Zhejiang University), Bin Gao(Tsinghua University)
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