Preparation of high thermal conductivity interface materials via thiol-ene click reaction between Si3N4 and BN
Yuze Wang(Southern University of Science and Technology), Peng Fei Liu(East China University of Science and Technology), Xiaoyu Zhang(Zhejiang Wanli University), Bihai Tong, Yong Wang(Hong Kong Polytechnic University), Han Zhao(Anhui University of Technology), Xian Zhang(Xidian University)
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