Application and Improvement of CU CMP Thickness Control Method Based on R2R System

Cheng Liu(Shanghai University), Yu Zhang(Nankai University), Mingfei Yu(Shanghai Huali Microelectronics (China)), Lei Zhang(Shanghai Huali Microelectronics (China)), Linlin Bi(Shanghai Huali Microelectronics (China)), Jingxun Fang(Shanghai Huali Microelectronics (China))
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