Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing
Kyusoon Pak(Korea Advanced Institute of Science and Technology), Steve Park(Seoul National University), Byungkook Oh(Korea Advanced Institute of Science and Technology), Jin‐Oh Kim(Korea Advanced Institute of Science and Technology), Seungkyu Lee(Korea Advanced Institute of Science and Technology), Jun Chang Yang(Korea Advanced Institute of Science and Technology), Minjoo Kang(Korea Advanced Institute of Science and Technology), Joo Yong Sim(Electronics and Telecommunications Research Institute), Do Hoon Lee(Korea Advanced Institute of Science and Technology), Taehoon Lee(Korea Advanced Institute of Science and Technology)
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