Highly‐Effective Thermoelectric Cooling for Power Semiconductor Devices Packed with Thermal‐Expansion Offset and Flame Retardancy Epoxy Resin
You Li(Qilu University of Technology), Junyou Yang(Shenyang University of Technology), Dongjie� Liu(Zhongkai University of Agriculture and Engineering), Xin Li(Guangxi Science and Technology Department), Ge Liu(Zhejiang Normal University), Yubo Luo(Huazhong University of Science and Technology), Wenyuan Ma(Huazhong University of Science and Technology), Tianshun Xiong(Huazhong University of Science and Technology), Shuangfu Gang(Huazhong University of Science and Technology), Qinghui Jiang(Huazhong University of Science and Technology)
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