Achieving the low stress and defects of diamond film by introduction of SiNx dielectric layer
Zhiliang Yang(University of Science and Technology Beijing), Chengming Li(University of Science and Technology Beijing), Xurui Feng(University of Science and Technology Beijing), Siyi Chan(University of Science and Technology Beijing), Junjun Wei(University of Science and Technology Beijing), Jinlong Liu(University of Science and Technology Beijing), Yuchen Liu(The Ohio State University), Kang An(University of Science and Technology Beijing), Liangxian Chen(University of Science and Technology Beijing), Yunkai Wang(University of Science and Technology Beijing), Zhijian Guo(University of Science and Technology Beijing)
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