High‐Reliability Simulation for Prediction Water Vapor Barrier Performance in Thin Film Encapsulation with Broad Application Potential
Xianwen Liu(Beijing Institute of Technology), Zhinong Yu(Beijing Institute of Technology), Shuo Zhang(State Grid Corporation of China (China)), Tao Wang(BOE Technology Group (China)), Bin Liu(Beijing Institute of Technology), Xuyang Li(Xi'an Technological University), Feng Wang(Shanghai Jiao Tong University), Ruijiang Hong(Kunming University of Science and Technology), Qi Yao(Beijing Institute of Technology), Tao Sun(BOE Technology Group (China))
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