Self‐Assembly and 3D Printing of SiC<sub>w</sub>@MXene/SiOC Metastructure Toward Simultaneously Excellent Terahertz Electromagnetic Interference (EMI) Shielding and Electron‐to‐Thermal Conversion Properties
Ruyue Su(Beijing Institute of Technology), Ying Li(South China Agricultural University), Rujie He(Beijing Institute of Technology), Pingan Liu(China Academy of Engineering Physics), Jingyi Chen(Beijing Institute of Technology), Xiaotong Chen(Beijing Institute of Technology), Wenqing Wang(Beijing Institute of Technology)
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