Negative thermal expansion of LiAlSiO <sub>4</sub> interlayer with AgCuTi filler for brazing SiC joints

Xuelong Cao(Anhui Institute of Information Technology), Yu Zhao(Anhui Polytechnic University), Hao Wang(Beijing Founder Electronics (China)), Boyu Dai(Anhui Polytechnic University), Rujie He(Beijing Institute of Technology), Ao Han(Anhui Polytechnic University), Gang Wang(Shanghai University)
International Journal of Applied Ceramic Technology
January 20, 2025
10.1111/ijac.15045
Cited by 2

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