Effect of 4h-N Type Conductive Sic [[Equation]] Wafer Anisotropy on the Dicing Section Quality in Laser Induced Thermal-Crack Propagation
Chunyang Zhao, Jiayan Sun(Shenzhen University), Jianguo Lei(Shenzhen University), Likuan Zhu(Shenzhen University), Zhihui Yang(Ministry of Education), Jingyi Fang
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