Reliable Simulation Analysis of Interface and SiON Degradation Effects on Water Vapor Barrier in Laminated Thin‐Film Encapsulation

Xianwen Liu(Beijing Institute of Technology), Zhinong Yu(Beijing Institute of Technology), Tao Sun(BOE Technology Group (China)), Tao Wang(BOE Technology Group (China)), Bin Liu(Beijing Institute of Technology), Xuyang Li(Xi'an Technological University), Feng Wang(Shanghai Jiao Tong University), Qi Yao(Beijing Institute of Technology), Anyuan Qiu(University of Science and Technology Beijing), Ruijiang Hong(Kunming University of Science and Technology), Shuo Zhang(Sichuan University), Zongchi Bao(Beijing Institute of Technology)
physica status solidi (a)
November 19, 2024
Cited by 1


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