Thermal Performance Analysis of Electronic Components on Different Substrate Materials
Anant Sidhappa Kurhade(Dr. D. Y. Patil Medical College, Hospital and Research Centre), Chaitalee Naresh Mali(Dr. D. Y. Patil Medical College, Hospital and Research Centre), Swapna Swapnil Jawalkar, Rahul Shivaji Yadav, Ramdas Biradar(MIT Art, Design and Technology University), Gulab Dattrao Siraskar(Dr D Y Patil Dental College & Hospital), Sagar Arjun Dalvi, A.A. Kadam(Directorate of Medicinal and Aromatic Plants Research), Tushar Gadekar, Shital Yashwant Waware(Dr. D. Y. Patil Medical College, Hospital and Research Centre)
Cited by 31
Related Papers
Computational study of PCM cooling for electronic circuit of smart-phone
|Materials Today Proceedings|2021|73
Thermal control of IC chips using phase change material: A CFD investigation
|International Journal of Modern Physics C|2022|44
Predictive Placement of IC Chips using ANN-GA Approach for Efficient Thermal Cooling
|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024|44
CFD Approach for Thermal Management to Enhance the Reliability of IC Chips
|International Journal of Engineering Trends and Technology|2022|43
A Comprehensive Evaluation of Recent Studies Investigating Nanofluids Utilization in Heat Exchangers
|Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024|43