Dissimilar low-temperature diffusion bonding of copper and titanium using a Zn interlayer: Interfacial microstructure and mechanical properties
Wei Feng(Chongqing University of Science and Technology), Qiang Shen(Wuhan University of Technology), Yong Xiao(Wuhan University of Technology), Hucheng Guo(Wuhan University of Technology), Guoqiang Luo(Wuhan University of Technology), Jian Zhang(Wuhan University of Technology)
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