Dissimilar low-temperature diffusion bonding of copper and titanium using a Zn interlayer: Interfacial microstructure and mechanical properties
Wei Feng(Unknown), Qiang Shen(Shanghai University), Yong Xiao(Wuhan University of Technology), Hucheng Guo(Wuhan University of Technology), Guoqiang Luo(Wuhan University of Technology), Jian Zhang(Wuhan University of Technology)
Cited by 12
Related Papers
NULISA: a proteomic liquid biopsy platform with attomolar sensitivity and high multiplexing
|Nature Communications|2023|203
Cation-inspired polyhedral distortion boosting moisture/electrolyte stability of iron sulfate cathode for durable high-temperature sodium-ion storage
|eScience|2024|69
Key technologies for laser-assisted precision grinding of 3D C/C-SiC composites
|Journal of the European Ceramic Society|2023|57
Failure analysis of a secondary driving helical gear in transmission of electric vehicle
|Engineering Failure Analysis|2020|51