Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock

Chen Peng(China Academy of Engineering Physics), Jilin Xie(Nanchang Hangkong University), Ming Wu(Nanchang Hangkong University), Timing Zhang(Nanchang Hangkong University), Ke-jiang YE(Nanchang Hangkong University), Wei-zheng CHEN(Nanchang Hangkong University), Yuhua Chen(Nanchang Hangkong University), Shanlin Wang(Dalian University of Technology), Limeng Yin(Chongqing University of Science and Technology)
Transactions of Nonferrous Metals Society of China
June 1, 2024
Cited by 18


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