Initiation and arrest of cracks from corners in multi-chip semiconductor devices

Guodong Nian(Harvard University), Zhigang Suo(Harvard University), Joost J. Vlassak(Harvard University), Yu-Sheng Lin(Taiwan Semiconductor Manufacturing Company (Taiwan)), Jiaming Yang(Taiwan Semiconductor Manufacturing Company (Taiwan)), Jun He(Taiwan Semiconductor Manufacturing Company (Taiwan)), Jyun-Lin Wu(Taiwan Semiconductor Manufacturing Company (Taiwan)), Sherwin Tang(Taiwan Semiconductor Manufacturing Company (Taiwan)), Sammy Hassan(Harvard University)
Journal of the Mechanics and Physics of Solids
June 27, 2024
Cited by 8


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