Material extrusion 3D printing of large-scale SiC honeycomb metastructure for ultra-broadband and high temperature electromagnetic wave absorption
Wenqing Wang(Beijing Institute of Technology), Rujie He(Beijing Institute of Technology), Zengchan Li(Beijing Institute of Technology), Yixing Huang(Beijing Institute of Technology), Xiong Gao(Shaanxi Yanchang Petroleum (China))
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