Rational design of high‐performance epoxy/expandable microsphere foam with outstanding mechanical, thermal, and dielectric properties
Haïwen Tang(Chengdu University), Xulin Yang(Composite Components (Czechia)), Ying Li(Chengdu University), Yingqing Zhan(Southwest Petroleum University), Kui Li(Chengdu University), Yi Li(Yunnan Agricultural University), Pan Wang(Chengdu University), Fei Zhong(Hubei University of Technology), Wei Feng(Chengdu University), Ziyi Zhu(Kunming University of Science and Technology)
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