Rational design of high‐performance epoxy/expandable microsphere foam with outstanding mechanical, thermal, and dielectric properties
Haïwen Tang(Chengdu University), Xulin Yang(University of Electronic Science and Technology of China), Ying Li(Chengdu University), Yingqing Zhan(University of Electronic Science and Technology of China), Kui Li(Chengdu University), Yi Li(Chinese University of Hong Kong), Pan Wang(Chengdu University), Fei Zhong(Chengdu University), Wei Feng(Chengdu University), Ziyi Zhu(Kunming University of Science and Technology)
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